Online Measurement for Etching & Washing Solution S.G, C% TWD-EW-ON-LINE Made in Taiwan
Application:
Ferric chloride, copper chloride etching tank, sodium carbonate aqueous solution, mixed solution of hydrochloric acid and hydrogen
peroxide, sodium hydroxide solution washing tank and solution density, concentration control sites in other industrial processes.
Principle:
Referring to the standard of GB/T611, T2423, T22230, T5009, ISO 6353, 758, and by adopting hydrostatics buoyancy method, Bernoulli principle of hydrodynamics to online monitor the specific gravity change of etching and washing solution, and then by applying Lagrange interpolation method, the dynamic data of online etching and washing solution concentration can be converted.
Buffering device: TP-30
Function:
With the special design of buffering device TP-30, it is fully consistent with the hydrostatic principle; the data tested will be more accurate.
Specifications:
Model |
TWD-EW-ONLINE |
S.G range |
0.0001 – 2.0000(glass weight) |
Testing type |
Specific Gravity (S.G), Concentration (C%) |
S.G precision |
0.0001 |
C% range |
0.1%~100.0% |
Standard interface |
RS-232 |
Technical data:
- Sodium carbonate aqueous solution can remove the regional development which is not affected by the light on the membrane surface.
- Mixed solution of hydrochloric acid and hydrogen peroxide can remove the uncovered copper foil corrosion.
- Sodium hydroxide solution is a strong electrolyte; it can remove the dry film photoresist.
- In the printed circuit, the reduction of etch rate has a relationship with solution specific gravity and the content of ammonium chloride.
- In etching solution, if the concentration of chloride ion is too high, it will cause the anti-corrosion metallic coating in printed circuit corrosion.
- In etching solution, if the content of chloride ion is too low, it will cause the copper surface blackening and the etching will be fixed.
Functions:
1. The main-body is placed on the easy-operation platform, and the main-body is equipped with sampling tank.
2. The testing liquid is in and out from the in-out hole on sampling tank, the liquid specific gravity will be showed automatically by according
to the buoyancy changing of sensor ball in sampling tank.
3. Just by continuous actions, the specific gravity measurement and monitor of etching and washing solution can be finished, and then the
dynamic data of online C% of etching and washing solution can be converted and showed.
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